Packaging materials
Essential chemistry for high-quality packaging solutions
Packaging materials
Essential chemistry for high-quality packaging solutions
Expancel® microspheres is used in board applications where a high bulk is needed. It will improve the bulk and bending stiffness of the board, 1% of Expancel® microspheres can increase the bulk by up to 25%. These effects are achieved when Expancel® slurry, added to the wet-end of the board machine, expands in the drying section, giving an increased bulk of the board.
Expancel® microspheres can also be used in a coating on the surface on board or paper to provide anti-slip properties.
Colloidal silica can be used to create an anti-slip surface on paper and packing materials. The higher coefficient of static friction makes stacking and handling of finished products simpler and more efficient.
When used to coat packaging materials, colloidal silica produces a porous surface coating that readily accepts water-based inks. This coating significantly improves the printability on these products – printed images are crisper and clearer, and the ink is less likely to bleed.
Our hydrogen peroxide is produced specifically for use in aseptic packaging machines; it is an effective product to sterilize the inside of an aseptic packaging container prior to filling - for bath and spray treatments.
Related products for packaging materials
Specifically produced for use in aseptic packaging machines; an effective product to sterilize the inside of an aseptic packaging container prior to filling.
We offer hydrogen peroxide – a strong oxidizing agent used to bleach both mechanical and chemical wood pulp – ECF and TCF processes.
Chlorine dioxide is critical in the production of elemental chlorine-free (ECF) bleached chemical wood pulp.
World's leading supplier of sodium chlorate used for chlorine-dioxide generation in pulp mill bleach plants.
Chelating agents for removal and deactivation of metal ions in pulp bleaching processes to prevent brightness reversion and lower production costs.
Expancel® microspheres for improving bulk or reducing grammage to keep the caliper of board.
Colloidal silica for enhancing the surface properties of paper and board products to improve printing and handling properties.
Our high-quality Finnfix® CMC cellulose ethers provide desired rheology, excellent water retention, and film forming capability.
For more information about our packaging material solutions, please contact our experts. We look forward to hearing from you.
If you prefer to call us you can reach us at:
China, Shanghai: +86 21 22205000
Brazil, Jundiaí: +55 11 45894800
Sweden, Bohus: +46 31 587000
USA, Marietta: +1 770 5780858
Expancel®, Levasil® and Eka® are registered trademarks of Nouryon in several countries worldwide.