Products and solutions

Dry powder of expanded thermoplastic microspheres used as a lightweight filler in civil explosives. It has a particle size of around 80 µm.

Dry powder of expanded thermoplastic microspheres used as a lightweight filler in applications such as civil explosives, construction sealants and thermosets. It has a particle size of around 40 µm.

Dry powder of expanded thermoplastic microspheres used as a lightweight filler in applications such as construction sealants and thermosets. It has a particle size of around 40 µm.

Wet expanded thermoplastic microspheres used as a lightweight filler in coatings applications. It has a small particle size of around 20 µm.

Dry powder of expanded thermoplastic microspheres used as a lightweight filler in applications such as coatings, automotive putty and thermosets . It has a particle size of around 20 µm.

Dry powder of expanded thermoplastic microspheres used as a lightweight filler in applications such as lightweight foam, printing blankets and coatings. It has a particle size of around 40 µm.

Dry powder of expanded thermoplastic microspheres used as a lightweight filler in adhesives. It has a particle size of around 80 µm.

Dry powder of expanded thermoplastic microspheres used as a lighweight filler in thermoset applications, as well as coatings and sealants. It has a particle size of around 20 µm.

Dry powder of expanded thermoplastic microspheres used as a lightweight filler in for example sealants, thermosets, rubber and coatings applications. It has a particle size of around 40 µm.

Wet expanded thermoplastic microspheres, used as a lighweight filler in coatings, porous ceramics and similar applicatinos. It has a particle size around 40 µm.

Wet, expanded thermoplastic microspheres used as a lightweight filler in coatings, porous ceramics and similar applications. It has a particle size of around 40 µm.

Dry powder of expanded thermoplastic microspheres used as a lightweight filler in automotive applications. It has a particle size of around 80 µm.